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Goal:
Prepare a recommendation for the X-FEL coupler design and development
Beginning |
Talk |
Speaker |
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General |
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9:00 |
Introduction: |
W.-D. Moeller |
9:20 |
R. Brinkmann |
|
9:50 |
D. Kostin |
|
Processing Time |
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11:20 |
P. Lepercq |
|
12:00 |
Residual gas analysis during processing at the TTF3 coupler and other labs |
D. Kostin |
Vacuum |
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14:10 |
M. Seidel |
|
14:50 |
Influence of different gas layers on the second. electron emission coefficient |
D. Kostin |
16:00 |
Pumping limitations of the TTF3 coupler and its vacuum connections |
J. Wojtkiewicz |
16:25 |
Limitations for the in situ baking of the coupler in the existing module design |
J. Hauschild |
17:00 |
C. Martens |
Beginning |
Talk |
Speaker |
---|---|---|
Qext |
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9:00 |
A. Labance |
|
9:50 |
V. Katalev |
|
coax diameter 40 vs. 60 mm |
||
10:20 |
D. Kostin |
|
11:20 |
W.-D. Moeller |
|
13:30 |
Perspectives for industrialization for XFEL input couplers |
S. Prat |
14:30 |
Discussion decisions and conclusions |
T. Garvey |
16:00 |
preparing a recommendation |
T. Garvey |