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XFEL Power Coupler Workshop, 25./26. Nov. 2003

Goal:

Prepare a recommendation for the X-FEL coupler design and development

Tuesday, 25.11.2003

Beginning

Talk

Speaker

 

General

 

9:00

Introduction:
What are the decisions we have to take now for the X-FEL

W.-D. Moeller

9:20

X-FEL Linac Parameters

R. Brinkmann

9:50

TTF 3 Coupler test & operating results

D. Kostin

 

Processing Time

 

11:20

Coupler processing times at other labs

P. Lepercq

12:00

Residual gas analysis during processing at the TTF3 coupler and other labs

D. Kostin

 

Vacuum

 

14:10

Effect of baking on high vacuum components

M. Seidel

14:50

Influence of different gas layers on the second. electron emission coefficient

D. Kostin

16:00

Pumping limitations of the TTF3 coupler and its vacuum connections

J. Wojtkiewicz

16:25

Limitations for the in situ baking of the coupler in the existing module design

J. Hauschild

17:00

Cold window vs. warm window from mech. design viewpoint

C. Martens

Wednesday, 26.11.2003

Beginning

Talk

Speaker

 

Qext

 

9:00

Field enhancement in the coupler due to change of Qext with a three-stub-tuner for the different X-FEL operating conditions

A. Labance

9:50

Limitations / performance of the existing tree stub tuner

V. Katalev

 

coax diameter 40 vs. 60 mm

 

10:20

Multipacting calculations and measurements on coupler tests

D. Kostin

     

11:20

Commissioning of modules on test stand or in tunnel

W.-D. Moeller

     

13:30

Perspectives for industrialization for XFEL input couplers

S. Prat

14:30

Discussion decisions and conclusions

T. Garvey

     

16:00

preparing a recommendation

T. Garvey

 

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